Current position: Home >> Scientific Research >> Research Projects

面向压力传感芯片应用的TiON薄膜应变机制与可靠性研究

Release Time:2026-03-21  Hits:

Discipline: Engineering

First-Level Discipline: Materials Science and Engineering

Note: 国家自然科学基金-联合基金重点支持项目

Project Source: 国家自然科学基金项目

Project Level: National level

Status: 在研

Nature of Project: 纵向

Project Approval Number: U2541262

Date of Project Approval: 2025-11-12

Scheduled Completion Time: 2029-12-31

Date of Project Initiation: 2026-01-01

Date of Project Completion: 2029-12-31

Next One:AlN基铁电薄膜漏导电流机制与调控