Current position: Home >> Scientific Research >> Paper Publications

Reliability Comparison of ZrO2-Based DRAM High-k Dielectrics Under DC and AC Stress

Release Time:2019-03-12  Hits:

Indexed by: Journal Article

Date of Publication: 2017-06-01

Journal: IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Included Journals: Scopus、EI、SCIE

Volume: 17

Issue: 2

Page Number: 324-330

ISSN: 1530-4388

Key Words: ZrO2; high-k; MIM capacitor; TDDB; AC stress

Abstract: In this paper, the time dependent dielectric breakdown behavior is investigated for production type crystalline ZrO2-based thin films under dc and ac stress. Constant voltage stress measurements over six decades in time show that the voltage acceleration of time-to-breakdown follows the conventional exponential law. The effects of ac stress on time-to-breakdown are studied in detail by changing the experimental parameters including stress voltage, base voltage, and frequency. In general, ac stressing gives rise to a gain in lifetime, which may result from less overall charge trapping. This trap dynamic was investigated by dielectric absorption measurements. Overall, the typical DRAM refresh of the capacitor leads to the most critical reliability concern.

Prev One:Synthesis of dopant-free tetragonal zirconia nano-powders with aqueous precursor and their optical properties

Next One:Facing-target mid-frequency magnetron reactive sputtered hafnium oxide film: Morphology and electrical properties