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Indexed by:会议论文

Date of Publication:2008-01-01

Included Journals:EI、CPCI-S

Volume:373-374

Page Number:480-483

Key Words:IMC layers; aging; growth behaviors; high magnetic field

Abstract:The growth behaviors of intermetallic compound (IMC) layers in soldered and diffusion bonding Sn/Cu joints and the effects of magnetic field have been investigated. The results indicate that, without high magnetic field, the growth behaviors of these two IMC layers are similar in the aging except the initial morphologies. However, the morphologies and crystal orientations of these two IMC layers have changed after being aged in high magnetic field.