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个人信息Personal Information
教授
博士生导师
硕士生导师
任职 : 日本东北大学金属材料研究所 客座教授 日本城西国际 客座教授
性别:男
毕业院校:日本东北大学
学位:博士
所在单位:材料科学与工程学院
学科:材料学. 材料加工工程. 材料物理与化学
办公地点:大连理工大学材料学院
联系方式:0411-84706063 http://anam.dlut.edu.cn
电子邮箱:wzhang@dlut.edu.cn
Enhancing the bio-corrosion resistance of Ni-free ZrCuFeAl bulk metallic glass through nitrogen plasma immersion ion implantation
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论文类型:期刊论文
发表时间:2014-12-05
发表刊物:International Symposium on Metastable, Amorphous and Nanostructured Materials (ISMANAM)
收录刊物:SCIE、CPCI-S、Scopus
卷号:615
期号:S1
页面范围:S660-S665
ISSN号:0925-8388
关键字:Bio-corrosion resistance; Ni-free Zr-based bulk metallic glass; Nitrogen plasma immersion ion; implantation; Pitting corrosion
摘要:Improving the resistance of bulk metallic glass (BMG) to corrosion, particularly pitting, is crucial to the further development of this material. This study employed surface treatment based on nitrogen plasma immersion ion implantation (N-PIII) to enhance the bio-corrosion resistance of Ni-free Zr62.5Cu22.5Fe5Al10 BMG for application in bone implants. Resistance to bin-corrosion was evaluated by establishing potentiodynamic polarization curves in artificial saliva (AS) and simulated body fluid (SBF). Commercial pure Ti was used as the control. Results demonstrate that N-PIII treatment did not alter the bulk amorphous structure of Zr62.5Cu22.5Fe5Al10 BMG. Following N-PIII treatment, a nitride-containing 15 nm thick oxide film was formed on the BMG. This film significantly improved resistance to bio-corrosion in both AS and SBF solutions. The N-PIII-treated BMG presented lower corrosion rates (50-67% less) and higher corrosion potential (800-1100 mV more) than that observed in untreated BMG and Ti. The N-PIII treatment also significantly improved resistance of the BMG to pitting (increased pitting potential by 500-700 mV). This is the first report of the outstanding resistance of Ni-free Zr-based BMG to bin-corrosion (i.e. corrosion rate 0.01 mu A/cm(2); pitting potential >1200 my; corrosion potential >270 mV) in simulated biological environments. (C) 2014 Elsevier B.V. All rights reserved.