Hits:

Date of Publication:2022-10-09

Journal:Journal of Dalian University of Technology

Volume:61

Issue:1

Page Number:39-45

ISSN No.:1000-8608

Key Words:"Al-Cu micro-laminated composite; vacuum hot pressing; microstructure; microhardness; electric conductivity; thermal conductivity"

CN No.:21-1117/N

Abstract:Al-Cu intermetallic compound micro-laminated composite is prepared by vacuum hot pressing method.The effects of holding time,hot pressing temperature and other process parameters of the forming process are studied.SEM is used to observe the micro morphology of the bonding interface,EPMA is used to characterize the distribution of elements at the interface,and the number and type of diffusion layer are determined.The hardness distribution at the bonding interface is analyzed by microhardness test.In addition,the electric conductivity and thermal conductivity of Al- Cu micro-laminated composite under different processing conditions are analyzed.The results show that with the increase of hot pressing temperature,the type and thickness of diffusion layer at the bonding interface of Al-Cu micro-laminated composite gradually increase,and the electric conductivity of the composite increases first and then decreases,while the thermal conductivity of the composite keeps a monotonous decline.The results of microhardness test show that the microhardness increases sharply from Cu layer and Al layer to diffusion layer,and the hardness reaches the maximum in the middle of diffusion layer.Finally,the optimal preparation process is determined as the hot pressing temperature of 570 ℃ and the holding time of 4h,the electric conductivity of the Al-Cu microlaminated composite is 55.75% (IACS)and the thermal conductivity is 258.3W/(m·K).

Note:新增回溯数据