Current position: Home >> Scientific Research >> Paper Publications

Cu基块体非晶合金板材水平连铸过程的数值模拟

Release Time:2024-11-24  Hits:

Date of Publication: 2022-10-06

Journal: Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volume: 30

Issue: 12

Page Number: 2901-2911

ISSN: 1004-0609

Prev One:Cu-Zr-Al-Y块体非晶合金复相材料的力学性能

Next One:真空水平连铸AZ31镁合金的显微组织与性能