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Hot embossing/bonding of a poly(ethylene terephthalate) (PET) microfluidic chip

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Date of Publication:2022-10-03

Journal:JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Affiliation of Author(s):机械工程学院

Volume:18

Issue:1

ISSN No.:0960-1317

Pre One:Hydrophobic marking line used to eliminate the edge effect in a microfluidic point-of-care testing device

Next One:Laser-bulge based ultrasonic bonding method for fabricating multilayer thermoplastic microfluidic devices
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