location: Current position: Home >> Scientific Research >> Paper Publications

微器件快速柔性胶粘接封合机研制

Hits:

Indexed by:期刊论文

Date of Publication:2022-06-30

Journal:机械设计与制造

Issue:5

Page Number:182-185

ISSN No.:1001-3997

Abstract:In order to decrease the defect of adhesive bonding process and increase the bonding rate,a fast,room-temperature adhesive bonding process has been developed for fabrication of microfluidic chips.According to this process,we developed a flexible material based adhesive bonding machine.A pneumatic-hydraulic cylinder was used in this machine.The pressure head was made of flexible material,fixed by a floating joint under the pneumatic-hydraulic cylinder.It moved through the sliding bearings,which was fixed in the frame.This machine was driven by pneumatic system.For the concern of safety,this bonding machine only can be started by two hands,and the pneumatic system can control the bonding pressure by pressure regulator and the bonding times by timer.The pressure head can return to original position automatically after achieving bonding time.This machine can improve the automation of adhesive bonding process,which only can be achieved by hands right now.

Note:新增回溯数据

Pre One:微流控芯片连续分离过程中样品稀释的研究

Next One:新型网状通道微流控细胞培养芯片设计与制作