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一种用于POCT芯片产品精密超声波焊接的压力自适应装置

Release Time:2022-10-19  Hits:

First Author: Li Jingmin

Disigner of the Invention: Chong Liu,刘军山,王立鼎

Institution: 机械工程学院

Application Number: ZL201510350252.1

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