Indexed by:Journal Papers

Date of Publication:2015-09-01

Journal:BULLETIN OF MATERIALS SCIENCE

Included Journals:SCIE、EI、Scopus

Volume:38

Issue:5

Page Number:1429-1433

ISSN No.:0250-4707

Key Words:Electron beam melting; silicon; oxygen; removal; electrical resistivity

Abstract:This research deals with the study of electron beam melting (EBM) methodology utilized in melting silicon material and subsequently discusses on the effect of oxygen level on electrical resistivity change after EBM process. The oxygen content was reduced from 6.177 to less than 0.0517 ppmw when refining time exceeded 10 min with removal efficiency of more than 99.08%. The average value of electrical resistivity of silicon before EBM processing was recorded to be 2.25 Omega cm but with the increase in melting time that was applied through EBM, the electrical resistivity was recorded to go high in the range of 4-13 Omega cm for different regions. The electrical resistivity values were greater in the top and the bottom regions, whereas lowest in the central region at all conditions of melting time. It is the result of the evaporation of oxygen during melting process and the segregation of metal impurities during solidification.