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纳米级球形硅基介孔材料的制备及粒径和形貌控制方法

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First Author:谷琳

Disigner of the Invention:guoxinwen,Liu Min,Zhang Anfeng,侯珂珂,代成义

Application Number:CN201110028385.9

Authorization Date:2011-01-26

Authorization number:CN102126729A

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