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个人信息Personal Information
副教授
博士生导师
硕士生导师
性别：男
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料加工工程
办公地点：大连理工大学铸造中工程心
电子邮箱：xsfu@dlut.edu.cn
Enhanced TiAl/Ti3SiC2 diffusion bonding by introducing amorphous intergranular films in Ti3SiC2 through Al doping
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论文类型：期刊论文
发表时间：2020-03-01
发表刊物：SCRIPTA MATERIALIA
收录刊物：EI、SCIE
卷号：178
页面范围：493-497
ISSN号：1359-6462
关键字：TiAI; Ti3SiC2; Diffusion bonding; Grain boundary diffusion; Amorphous intergranular films
摘要：The Al-enriched amorphous intergranular films were firstly found and introduced in Ti3SiC2 substrates through Al doping, for enhancing the TiAl/Ti3SiC2 diffusion bonding. The existence of the Al-enriched amorphous intergranular films changed the main diffusion element from Si in the undoped TiAl/Ti3SiC2 joint to Al in the Al-doped joints. The build-ups of the interfacial compounds were gamma+alpha(2)/gamma/Ti5Si3/Ti3SiC2 in the undoped TiAI/Ti3SiC2 joint and were gamma+alpha(2)/gamma/TiAl2/TiAl3+Ti5Si3+Ti5Si4/Ti3SiC2 in the Al-doped joints. The formation of the brittle Ti5Si3 layer was inhibited through Al doping, which enhanced the shear strength of the joint. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.