大连理工大学主页平台管理系统付雪松 Enhanced TiAl/Ti3SiC2 diffusion bonding by introducing amorphous intergranular films in Ti3SiC2 through Al doping 中文主页

论文成果

Enhanced TiAl/Ti3SiC2 diffusion bonding by introducing amorphous intergranular films in Ti3SiC2 through Al doping: 点击次数：; 发布时间： 2020-02-17; 发布时间：2020-02-17; 论文类型：期刊论文; 发表时间：2020-03-01; 发表刊物：SCRIPTA MATERIALIA; 收录刊物：SCIE、EI; 卷号：178; 页面范围：493-497; ISSN号：1359-6462; 关键字：TiAI; Ti3SiC2; Diffusion bonding; Grain boundary diffusion; Amorphous intergranular films; 摘要：The Al-enriched amorphous intergranular films were firstly found and introduced in Ti3SiC2 substrates through Al doping, for enhancing the TiAl/Ti3SiC2 diffusion bonding. The existence of the Al-enriched amorphous intergranular films changed the main diffusion element from Si in the undoped TiAl/Ti3SiC2 joint to Al in the Al-doped joints. The build-ups of the interfacial compounds were gamma+alpha(2)/gamma/Ti5Si3/Ti3SiC2 in the undoped TiAI/Ti3SiC2 joint and were gamma+alpha(2)/gamma/TiAl2/TiAl3+Ti5Si3+Ti5Si4/Ti3SiC2 in the Al-doped joints. The formation of the brittle Ti5Si3 layer was inhibited through Al doping, which enhanced the shear strength of the joint. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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副教授博士生导师硕士生导师

性别：男

毕业院校：大连理工大学

学位：博士

所在单位：材料科学与工程学院

学科：材料加工工程

办公地点：大连理工大学铸造中工程心

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