Release Time:2022-10-08 Hits:
Date of Publication: 2022-10-08
Journal: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume: 53
Page Number: 1-7
ISSN: 1369-8001
Prev One:Surface damage and metal-catalyzed chemical etching investigation of multicrystalline silicon by diamond wire sawing
Next One:Preparation of silicon target material by adding Al-B master alloy in directional solidification