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一种底部气冷的多晶硅半熔铸锭装置及工艺

Release Time:2022-10-19  Hits:

First Author: 姜大川

Disigner of the Invention: 李佳艳,Yi Tan,李鹏廷,任世强

Institution: 材料科学与工程学院

Application Number: CN104131345A

Authorization Number: CN201410342848.2

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