大连理工大学主页平台管理系统康慧君 Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation Home

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Release Time:2022-10-03 Hits:

Date of Publication: 2022-10-02
Journal: INTERMETALLICS
Institution: 材料科学与工程学院
Volume: 58
Page Number: 84-90
ISSN: 0966-9795