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哈尔滨工业大学

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Growth behavior of Cu6Sn5 in Sn-6.5 Cu solders under DC considering trace Al: In situ observation

Date of Publication:2022-10-02 Hits:

Date of Publication:2022-10-02
Journal:INTERMETALLICS
Affiliation of Author(s):材料科学与工程学院
Volume:58
Page Number:84-90
ISSN No.:0966-9795