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Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography

Release Time:2022-10-09 Hits:

Date of Publication: 2022-10-08
Journal: JOURNAL OF ALLOYS AND COMPOUNDS
Institution: 材料科学与工程学院
Volume: 616
Page Number: 550-555
ISSN: 0925-8388

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