Doctoral Degree

哈尔滨工业大学

Recommended Ph.D.Supervisor

Recommended MA Supervisor

Institutional Repository Personal Page

Personal Information

Gender:Male
Business Address:大连理工大学铸造中心315
E-Mail:

VIEW MORE
Home > Scientific Research > Paper Publications

Enhancing the Thermoelectric and Mechanical Properties of CuNiMn Alloys by Introducing Si Impurity Atoms and Twins

Release Time:2024-03-29 Hits:

Indexed by: Journal Papers
Document Code: 383020
Date of Publication: 2023-09-29
Journal: ACS APPLIED ELECTRONIC MATERIALS
Key Words: CU; DEPENDENCE; PERFORMANCE; PHONON-SCATTERING; POTENTIAL BARRIER SCATTERING; THERMAL-CONDUCTIVITY

Prev One:Effect of Composition Regulation on Thermoelectric Properties of Fe3Al2Si3-Based Compounds

Next One:Enhancing Thermoelectric Performance of CuInTe2 via Trace Ag Doping at Indium Sites

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click:  | The Last Update Time:..  | Open Time:..  | DALIAN UNIVERSITY OF TECHNOLOGY | Login