Doctoral Degree
哈尔滨工业大学
Gender:Male
Business Address:大连理工大学铸造中心315
E-Mail:kanghuijun@dlut.edu.cn
Date of Publication:2024-11-15
Journal:ACS Applied Electronic Materials
ISSN No.:2637-6113
Key Words:As doping; Composite phase; Copper alloys; Entropy engineering; Error correction; Low thermal conductivity; Medium entropy; Seebeck; Structure modulation; Tellurium compounds; Thermal conductivity of solids; Thermal Engineering; Thermoelectric; Thermoelectric material; Thermo-Electric materials; Tin alloys; Zinc alloys
