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哈尔滨工业大学

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原位双相颗粒增强铜基复合材料及其制备方法

Release Time:2021-01-05 Hits:

First Author: 王骏杰
Disigner of the Invention: 邹存磊,康慧君,李金玲,Chen Diffen,张玉伟,Yiping Lu,接金川,Yubo ZHANG,曹志强,李廷举
Authorization Number: ZL201710598347.4