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原位双相颗粒增强铜基复合材料

Release Time:2022-10-19 Hits:

First Author: 王同敏
Disigner of the Invention: 邹存磊,康慧君,Chen Diffen,Yiping Lu,接金川,Yubo ZHANG,曹志强,李廷举
Institution: 材料科学与工程学院
Application Number: 2017105983474
Authorization Number: 2017105983474

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