Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography
发表时间：2022-10-09 点击次数：
论文名称：Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography
发表刊物：JOURNAL OF ALLOYS AND COMPOUNDS
所属单位：材料科学与工程学院
卷号：616
页面范围：550-555
ISSN号：0925-8388
发表时间：2022-10-08
