A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering
Release Time:2022-10-07 Hits:
Date of Publication: 2022-10-04
Journal: Journal of Materials Science Technology
Institution: 机械工程学院
Volume: 50
Page Number: 115-127
ISSN: 1005-0302