Current position: Home >> Scientific Research >> Paper Publications

Thermal network model of multichip PP IEGT considering the thermal coupling effects

Release Time:2022-10-07  Hits:

Date of Publication: 2022-10-03

Journal: IET Conference Publications

Volume: 2020

Issue: CP775

Page Number: 1219-1225

Prev One:The Vibration Analysis of TBM Tunnelling Parameters Based on Dynamic Model

Next One:Transient junction temperature prediction of IEGT in Modular Multilevel Converter sub-module based on FEM