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Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

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Date of Publication:2022-10-02

Journal:MICROELECTRONICS AND RELIABILITY

Affiliation of Author(s):机械工程学院

Volume:80

Page Number:55-67

ISSN No.:0026-2714

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