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Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints

Release Time:2022-10-07  Hits:

Date of Publication: 2022-10-02

Journal: APPLIED PHYSICS A MATERIALS SCIENCE PROCESSING

Institution: 材料科学与工程学院

Volume: 122

Issue: 12

ISSN: 0947-8396

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