Release Time:2026-03-18 Hits:
Indexed by: Journal Papers
Document Code: 481538
Date of Publication: 2025-06-15
Journal: 电子机械工程
Volume: 41
Issue: 03
Page Number: 59-65
ISSN: 1008-5300
Key Words: embedded heat dissipation; micro-rib array; structure optimization; T/R module
CN: 32-1539/TN