Grain boundary migration behavior and microstructure evolution during multilayer additive hot-compression bonding
Release Time:2024-05-23 Hits:
Indexed by: Journal Papers
Document Code: 384448
Date of Publication: 2023-12-18
Journal: JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
Volume: 28
Page Number: 789-798
ISSN: 2238-7854
Key Words: ALLOYS; COPPER; DEFORMATION; DYNAMIC RECRYSTALLIZATION; MACROSEGREGATION; MECHANICAL-PROPERTIES; STRAIN-RATE
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