Hits:
First Author:WANG Tongmin
Disigner of the Invention:Chen Diffen,Kang Huijun,litingju,caozhiqiang,Yiping Lu,Yubo ZHANG
Affilication of Author(s):材料科学与工程学院
Application Number:ZL201710351573.2
Pre One:析出强化型高强高导CuZr合金及其制备方法
Next One:原位双相颗粒增强铜基复合材料