Release Time:2022-10-19 Hits:
First Author: 郭恩宇
Disigner of the Invention: Yiping Lu,曹志强,王同敏,高民强,康慧君,Chen Diffen,wangwei,李廷举,接金川,Yubo ZHANG
Institution: 材料科学与工程学院
Application Number: CN109210941A
Authorization Number: CN201811035308.4
Prev One:原位双相颗粒增强铜基复合材料
Next One:一种制备优良热电性能合金的方法及优良热电性能合金