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  • 教师姓名:张宇博
  • 性别:
  • 电子邮箱:ybzhang@dlut.edu.cn
  • 职称:副教授
  • 所在单位:材料科学与工程学院
  • 学位:博士
  • 毕业院校:大连理工大学
  • 办公地点:铸造中心101室
  • 联系方式:ybzhang@dlut.edu.cn
论文成果
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Solidification Characteristics and Segregation Behavior of Cu-15Ni-8Sn Alloy
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  • 论文类型:期刊论文
  • 发表时间:2020-03-01
  • 发表刊物:METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
  • 收录刊物:EI、SCIE
  • 卷号:51
  • 期号:3
  • 页面范围:1229-1241
  • ISSN号:1073-5623
  • 摘要:The solidification characteristics and segregation behavior of Cu-15Ni-8Sn alloy were systematically investigated in the present study. The solidification characteristics were revealed with the assistance of a solidification quenching experiment, DTA analysis and Scheil simulation. The solidification microstructure of Cu-15Ni-8Sn alloy was characterized by SEM, and the results indicated that the as-cast microstructure of Cu-15Ni-8Sn alloy mainly consists of Sn-depleted alpha-Cu(Ni,Sn) matrix, Sn-rich gamma phase and lamellar (alpha + gamma) structure. It has been demonstrated that the solidification process begins with the nucleation and growth of primary Sn-depleted alpha(1) phase (L -> alpha(1) at 1114 degrees C) and terminates with the divorced eutectic reaction (L-2 -> alpha(2) + gamma at 868 degrees C). During the subsequent cooling process, the discontinuous precipitation (alpha(2) -> alpha(1) + gamma) takes place in the temperature range from about 700 degrees C to 600 degrees C. In addition, the macrosegregation behavior of Sn in Cu-15Ni-8Sn alloy was investigated by adopting vertical unidirectional solidification and measuring the cooling curves at different positions. The results indicated that an inverse macrosegregation of Sn solute exists in the as-prepared ingot, which mainly segregates at the chill surface of the alloy ingot. Namely, the Sn content is higher than 8 wt pct at the chill surface and about 8 wt pct inside the ingot for Cu-15Ni-8Sn alloy. (C) The Minerals, Metals & Materials Society and ASM International 2020
  • 发表时间:2020-03-01