An analytical model to predict the depth of sub-surface damage for grinding of brittle materials
Release Time:2023-03-09 Hits:
Date of Publication: 2022-10-05
Journal: CIRP JOURNAL OF MANUFACTURING SCIENCE AND TECHNOLOGY
Volume: 33
Page Number: 454-464
ISSN: 1755-5817
Key Words: "Silicon; Analytical model; Sub-surface damage; Dislocation; Fracture mechanics"