Hits:
Date of Publication:2022-10-09
Journal:大连理工大学学报
Volume:58
Issue:5
Page Number:471-478
ISSN No.:1000-8608
Note:新增回溯数据
Pre One:Surface roughness measurement accuracy analysis of grinded silicon wafer by white light scanning interferometry (WLSI)
Next One:Evaluation of Internal Residual Stresses in Rolled Pure Copper Plate
