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论文类型：期刊论文

发表时间：2012-06-01

发表刊物：INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

收录刊物：SCIE、EI、Scopus

卷号：60

期号：9-12

页面范围：933-938

ISSN号：0268-3768

关键字：Ultrafine diamond grinding wheel; Nanogrinding; HgCdTe; Ceramic bond

摘要：Nanogrinding experiments on soft-brittle monocrystalline mercury cadmium telluride (HgCdTe, MCT) were conducted using a novel developed ceramic bond ultrafine diamond grinding wheel. The experimental results showed that the ultrafine grinding wheel exhibited excellent grinding performance on HgCdTe wafers. Surface roughness Ra 1.4 nm, rms 1.7 nm, and PV 10.9 nm were respectively achieved under nanogrinding using this diamond grinding wheel. All the ground surfaces of MCT wafers exhibited ductile mode character, free of cracking and burn damage. The nanogrinding results were discussed in terms of the ceramic bond, as well as maximum undeformed chip thickness.