Enhancing the Thermoelectric and Mechanical Properties of CuNiMn Alloys by Introducing Si Impurity Atoms and Twins
Release Time:2024-04-02 Hits:
Indexed by: Journal Papers
Document Code: 383020
Date of Publication: 2023-09-29
Journal: ACS APPLIED ELECTRONIC MATERIALS
Key Words: CU; DEPENDENCE; PERFORMANCE; PHONON-SCATTERING; POTENTIAL BARRIER SCATTERING; THERMAL-CONDUCTIVITY