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A Cubic CuInTe2-Based Material Modulated by Entropy Engineering

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Date of Publication:2024-11-15

Journal:ACS Applied Electronic Materials

ISSN No.:2637-6113

Key Words:As doping; Composite phase; Copper alloys; Entropy engineering; Error correction; Low thermal conductivity; Medium entropy; Seebeck; Structure modulation; Tellurium compounds; Thermal conductivity of solids; Thermal Engineering; Thermoelectric; Thermoelectric material; Thermo-Electric materials; Tin alloys; Zinc alloys

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