Release Time:2024-11-25  Hits:

Date of Publication: 2024-11-15

Journal: ACS Applied Electronic Materials

ISSN: 2637-6113

Key Words: As doping; Composite phase; Copper alloys; Entropy engineering; Error correction; Low thermal conductivity; Medium entropy; Seebeck; Structure modulation; Tellurium compounds; Thermal conductivity of solids; Thermal Engineering; Thermoelectric; Thermoelectric material; Thermo-Electric materials; Tin alloys; Zinc alloys