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Vacuum diffusion bonding of TC4 titanium alloy to T2 copper with VCrNi1.8 eutectic medium entropy alloy interlayer

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Date of Publication:2024-09-04

Journal:MATERIALS CHARACTERIZATION

Volume:214

ISSN No.:1044-5803

Key Words:MECHANICAL-PROPERTIES; MICROSTRUCTURE; STRENGTH; TI-6AL-4V

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