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Vacuum diffusion bonding of TC4 titanium alloy to T2 copper with VCrNi1.8 eutectic medium entropy alloy interlayer

Release Time:2025-06-11  Hits:

Date of Publication: 2024-09-04

Journal: MATERIALS CHARACTERIZATION

Volume: 214

ISSN: 1044-5803

Key Words: MECHANICAL-PROPERTIES; MICROSTRUCTURE; STRENGTH; TI-6AL-4V

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