Indexed by:会议论文
Date of Publication:2015-08-16
Page Number:54-54
Key Words:胶接接头;光学测量;反演研究;材料单;位移载荷;黏接结构;复合材料界面;层应力;光测;界面应力;
Abstract:通过光学测量和数值反演相结合,组建了数字化复合材料界面断裂实验系统,对T300/QY891层合板单搭接胶接接头进行了拉伸剪切试验,通过数字图像相关法(DICM)测量了胶层两侧被黏接结构外表面的全场面内位移,并记录为结构在不同加载阶段的外表面位移,再通过结构变形分析和插值,得到被黏结物上下表面位移之间的定量关系,将基于光学测量数据和插值得到的各时刻两个被黏结物内表面的位移作为胶层单元各时刻上、下表面的位移载荷条件,开展胶层应力反演.
Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates
Gender:Male
Alma Mater:Dalian University of Technology (DUT)
Degree:Doctoral Degree
School/Department:State Key Laboratory of Industrial Equipment for Structral Analysis, Department of Engineering Mechanics
Discipline:Solid Mechanics. Applied and Experimental Mechanics. Engineering Mechanics. Mechanical Manufacture and Automation. Vehicle Engineering. Aerospace Mechanics and Engineering. mechanics of manufacturing process
Business Address:Room 321, Department of Engineering Mechanics
Contact Information:Tel.: 86 0411-84708406 Email: leizk@dlut.edu.cn
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