Indexed by:期刊论文
Date of Publication:2012-07-01
Journal:OPTICS AND LASERS IN ENGINEERING
Included Journals:SCIE、EI
Volume:50
Issue:7
Page Number:964-970
ISSN No.:0143-8166
Key Words:CTOA; CTOD; DCB; DIC
Abstract:The crack-tip opening angle (CTOA) and the crack-tip opening displacement (CTOD) are used as fracture parameters for characterizing the resistance of a material to fracture and predicting the instability of crack propagating fracture process. Digital image correlation method (DIC) was used to measure the displacement fields in a double cantilever beam (DCB) test with an initial interfacial crack. An apparent crack-tip was determined using the y-displacement along two parallel lines of the two crack flanks, which in turn enables the CTOA and CTOD to be evaluated. The experimental results revealed that the extension process for interface crack is divided into stable and unstable crack extension phases which changed alternately in the DCB test. The crack growth rate (CGR) varied from one stable phase to another, but was a constant value within each stable phase. The CGR, however, increased gradually over time within the unstable phases. The CTOA and CTOD did not increase synchronously in the loading process: the CTOA begins to increase at the first stable crack growth phase, whereas, the CTOD increased rapidly with the CTOA until entered into the second phase of unstable crack propagation. The above crack propagation behaviour on the bi-material corresponds to the interface crack transition, which is transformed from the tearing crack Mode I gradually into the mixed Mode I/II crack form. (C) 2012 Elsevier Ltd. All rights reserved.
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Gender:Male
Alma Mater:Dalian University of Technology (DUT)
Degree:Doctoral Degree
School/Department:State Key Laboratory of Industrial Equipment for Structral Analysis, Department of Engineering Mechanics
Discipline:Solid Mechanics. Applied and Experimental Mechanics. Engineering Mechanics. Mechanical Manufacture and Automation. Vehicle Engineering. Aerospace Mechanics and Engineering. mechanics of manufacturing process
Business Address:Room 321, Department of Engineering Mechanics
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