Indexed by:期刊论文

Date of Publication:2011-12-01

Journal:OPTOELECTRONICS AND ADVANCED MATERIALS-RAPID COMMUNICATIONS

Included Journals:Scopus、SCIE

Volume:5

Issue:12

Page Number:1328-1335

ISSN No.:1842-6573

Key Words:Piezoelectric composite; Fracture toughness; Finite element analysis; Debonding; Photoelasticity

Abstract:In this paper, piezoelectric composite specimens with epoxy resin adhesive for fixed-ratio mixed-mode (FRMM) fracture tests with photoelasticity analysis were performed. The deformation and strain field are obtained by digital image correlation (DIC) technologies, and the beam theory is used to calculate the critical fracture energies for piezoelectric composites. The values of SERR were calculated using the Virtual Crack Closure Technique and the traction-separation law for VCCT and CZM approaches respectively. Good agreement of the load-displacement response was obtained between the FEA and experimental results when using CZM approach. On the other hand, although the VCCT approach cannot provide precise simulation of the crack initiation, it can be considered as an efficient alternative in modelling the crack propagation phase. Our study demonstrates the digital photoelastic FRMM test is simple and validated for piezoelectric composite and the CZM can well characterize the interface debonding fracture of piezoelectric composite materials with a weak bonding interface.