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论文类型： 会议论文

发表时间： 2016-08-16

收录刊物： EI、CPCI-S、Scopus

页面范围： 301-303

关键字： bath temperaturet; co-electroplating; Au-Sn alloys; electrochemical behavior

摘要： Au-30at.%Sn eutectic alloy is useful in electronics for its superior mechanical and thermal conduction properties. Compared with traditional methods (Au-Sn solder preform and evaporation), the electroplating is an attractive method to obtain Au-Sn solder due to its cost-effective. In this work, Au-Sn films were co-electroplated via a pyrophosphate based bath. Electrochemical studies have been conducted to examine the effects of bath temperature on plating process. It was found that the rate for deposition of Au-Sn alloys was increased with bath temperature increased. Besides, the effects of bath temperature on the morphology and composition of electrodeposits were discussed.