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发布时间：2019-03-10

论文类型：会议论文

发表时间：2016-08-16

收录刊物：Scopus、CPCI-S、EI

页面范围：538-541

关键字：Non-cyanide electroplating; Au-Sn alloys; high stability; Composition optimization

摘要：A highly stable non-cyanide electroplating bath which can maintain clear at least one month was developed based on Au(III)-Sn(II) using 5,5-dimetheyl-hydantoin (DMH) and pyrophosphate as complexes. The combination of DMH and pyrophosphate can effectively minimize the difference of the deposition potentials between Au and Sn, making the codeposition of Au-Sn alloys possible. The cyclic voltammetry (CV) curve revealed that the codeposition of Au and Sn occurred at the potential of -790mV with a peak potential of -900mV. Pulsed plating was employed to optimize the morphology and composition of Au-Sn alloy films. The effects of pulse frequency, duty percentsge and peak current density on the morphology and composition of the deposits were investigated. The compact Au-Sn eutectic alloy with Sn content controlled from 10 at. % to 50 at. % can be obtained. The Au-Sn deposits were characterized by the scanning electron microscopic (SEM) and energy-dispersive spectroscopic (EDS) analyses.