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论文类型： 会议论文

发表时间： 2016-03-13

收录刊物： EI、CPCI-S

摘要： Synchrotron radiation real-time imaging technology was used to in situ study the precipitation and dissolution behavior of interfacial CusSns under temperature gradient during soldering. At the cold end, the pre-formed CusSns grains continued to grow at a fast rate with increasing aspect ratio. Whereas at the hot end, the pre-formed CusSns grains dissolved into the liquid solder rapidly then maintained as an extremely thin, scallop-like IMC layer. The thermomigration of Cu atoms from the hot end towards the cold end was responsible for the asymmetrical morphology of the interfacial CusSns between the cold and hot ends.