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论文类型： 会议论文

发表时间： 2012-08-13

收录刊物： EI、CPCI-S、SCIE、Scopus

页面范围： 493-497

摘要： The interfacial reactions between (111) Cu single crystals and lead-free solders (pure Sn, Sn-0.7Cu and Sn-0.7Cu0.1Ni) during solid-state aging at 150 degrees C were investigated in this study. The morphological evolution and the growth behavior of interfacial IMCs during short-period (0 to 100 h) aging process were studied. For the solders without Ni, the interfacial CU6Sn5 grains displayed prism shape in assoldered state. But after a very short-period aging, their morphology quickly turned into a facet scallop type. It was considered that the morphological change was induced by the broken of the initial interfacial balance, i.e., the rapid formation and growth of a new CU3Sn layer at the CU6Sn5/Cu interface broke the local equilibrium. Furthermore, a small amount addition of Ni into the solder resulted in a great variation in morphology and growth behavior of the interfacial IMCs.