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论文类型： 会议论文

发表时间： 2012-01-01

收录刊物： CPCI-S、Scopus

页面范围： 822-826

摘要： A mathematical model that can well describe the kinetics of liquid/solid reaction between Sn-Ag-Cu solder balls and Cu substrates was developed in this study. The Cu consumption and the intermetallic compound (IMC) thickness as functions of reflow time for solder balls with different volumes and initial Cu concentrations were obtained from the model. Multiphysics finite element (FE) software was applied to solve the equations and visualize the numerical results. Furthermore, Sn-3.5Ag and Sn-3.0Ag-0.5Cu solder balls with different sizes (200, 300, 400, and 500 mu m in diameter) were employed to react with Cu pads for various reflow times. The experimental measurements were compared with the simulated results and good consistency was obtained.