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发布时间：2019-03-11

论文类型：会议论文

发表时间：2011-08-08

收录刊物：Scopus、CPCI-S、EI

页面范围：333-337

摘要：Three new Sn-Zn based lead-free solders were used to join Al and Cu in this study. Needle-like Zn phases and AgZn3 phases formed in the bulk solder of 1# and 3#, however, globular-like Zn phases were found in the microstructure of 2# bulk solder. 2# solder owned the best wettalility on the Cu substrates and Al substrates. In as-soldered joints of all the solders, the Al4.2Cu3.2Zn0.7 compound layer formed at the interface of solder and Cu, while the Al-Zn-Sn solid solution zone formed at the interface of solder and Al. The AgZn3 phase was also found at the interface of 1# and 3# solder and the eutectic mixture of 2# solder had more homogeneous distribution than those of 1#, 3# and Sn-9Zn solder joints. The microstructure of 2# solder joint induced higher shear strength than those of 1#, 3# and Sn-9Zn solder joints. The corrosion potential of 1# solder was more noble than those of 2# solder and 3# solder in 3.5% NaCl solution.