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论文类型： 会议论文

发表时间： 2009-08-10

收录刊物： EI、CPCI-S、SCIE、Scopus

页面范围： 517-520

摘要： This work compared the interfacial reactions of single crystal Cu and polycrystalline Cu with the high-Sn solders. The morphology aspects of Cu(6)Sn(5) intermetallic compound (IMC) grains formed between (001) single crystal Cu and high-Sn solder bath (pure Sn, Sn-0.7Cu, Sn-3Cu) at 250 degrees C and 300 degrees C for different durations ranging from 10 s to 10 min were investigated. The Cu(6)Sn(5) grains formed in all solder baths at 250 degrees C displayed common scallop-type, while those formed in pure Sn and Sn-0.7Cu baths at 300 degrees C displayed rooftop-type in early stage of the interfacial reaction (less than 10 min). Both the top-view morphology and cross-section morphology of the interfacial Cu(6)Sn(5) IMC formed on single crystal Cu at 300 degrees C are different from those formed on polycrystalline Cu. From the top-view, the rooftop-type Cu(6)Sn(5) grains formed on (001) single crystal Cu are elongated along two perpendicular directions; from the cross-section view, the IMC layers present a relatively planar intermetallic structure. Furthermore, Cu(6)Sn(5) grains formed between Sn-0.7Cu/(001)Cu partly changed from rooftop-type to scallop-type when the reaction time is up to 10 min; Cu(6)Sn(5) grains formed between pure Sn/(001)Cu remained rooftop-type even after the reaction for up to 10 min. It is considered that reaction temperature and Cu concentration in the solder bath have an effect on the formation of rooftop-type Cu(6)Sn(5) grains. The dissolution rate of single crystal Cu in the high-Sn solder is higher than polycrystalline Cu in solder bath at 300 degrees C, which indicated that the morphology of Cu(6)Sn(5) affects the dissolution of substrate Cu.