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黄明亮
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教授   博士生导师   硕士生导师

性别: 男

毕业院校: 大连理工大学

学位: 博士

所在单位: 材料科学与工程学院

学科: 材料学. 功能材料化学与化工. 化学工程

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The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate

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论文类型: 会议论文

发表时间: 2012-01-01

收录刊物: Scopus

页面范围: 361-365

摘要: The rapidly-solidified lead-free solders had lower melting point, narrower melting interval, better wettability and improved mechanical performance because of the fine, uniform and small segregation microstructure compared with the as-cast lead-free solders. In this study, a rapidly-solidified Sn-0.7Cu eutectic alloy was used as a sample for investigating the microstructure, wettability and the Cu6Sn5 IMCs and their growth behavior formed between the solders and Cu substrate. In addition, an as-cast Sn-0.7Cu solder was prepared as a reference. The results of the study showed that the microstructure composition was more uniform, the wettability was much better, the melting rate was much faster of the rapidly-solidified Sn-0.7Cu solders than the as-cast solders; the morphology of Cu6Sn5 grains formed between solders and substrate was different between rapidly-solidified and as-cast Sn-0.7Cu solders in short soldering duration; the rapidly-solidified Sn-0.7Cu solders were suitable for soldering with low temperature and short duration. ? 2012 IEEE.

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