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论文类型： 会议论文

发表时间： 2012-08-13

收录刊物： EI、Scopus

页面范围： 393-397

摘要： The effect of the concentration gradient lies in the solder on the interfacial reaction was investigated in this paper. Sn-9Zn/Sn double layers solders were reacted with Cu at 250  C for 1-5min. The concentration gradient and its direction affect the composition and the morphology of the reaction products. When the reflow time was less than 3min, the reaction products were Cu5Zn8 and CuZn5, only Cu5Zn 8 was found when the reflow time was 5min. Solder pieces with different thicknesses were reacted at 250  C for 5min. Only Cu 5Zn8 was found at the interface and the size and the amount of the reaction product changed as the thickness varied. When the thickness of the solder piece was 300  m, bulk type Cu5Zn 8 with large faceted surfaces was observed in the fine grains Cu 5Zn8 phase next to the Cu substrate. ? 2012 IEEE.