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论文类型： 会议论文

发表时间： 2017-01-01

收录刊物： SCIE、EI、CPCI-S、Scopus

页面范围： 1286-1290

关键字： Cu/Sn/Cu interconnect; thermal aging; tensile test; failure analysis; interfacial reaction; thickness

摘要： The effect of intermetallic compound (IMC) thickness on tensile behavior of the Cu/Sn/Cu micro interconnects was investigated after thermal aging under synchrotron radiation experiments, and the tensile strength of the full IMC interconnects was also measured. The results showed that a thicker IMC layer induced a higher tensile strength of the Cu/Sn/Cu interconnects. The average tensile strength of full IMC interconnects exceeded 90 MPa, which was higher than that of Sn containing interconnects. Moreover, the fracture mode tended to change from ductile fracture inside the solder to brittle failure at the CU3Sn/Cu6Sn5 interface. The failure was attributed to the bubbles at the interface as well as the stress concentration at corners. The uneven interface between the interfacial IMC and the solder can improve the tensile strength of micro interconnects.