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发布时间：2019-03-13

论文类型：期刊论文

发表时间：2016-05-10

发表刊物：MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

收录刊物：EI、SCIE

卷号：664

页面范围：221-226

ISSN号：0921-5093

关键字：Au-Sn solder; Cluster-plus-glue-atom model; Eutectic; Microstructure; Shear strength; Interfacial reaction

摘要：Novel Sn-rich Au-Sn solder alloys were designed using the cluster-plus-glue-atom (CPGA) model, and the microstructure, melting behavior, wettability and mechanical properties of the designed Sn-Au-Ag(Ni) solders were systematically investigated. The cluster formula of [Sn11Au2]Sn-3, a stable Sn-centered cluster (11 Sn atoms and 2 Au atoms) plus 3 Sn glue-atoms, is applicable to substitute Ag and Ni for Au. The [Sn11AuAg]Sn-3 and [Sn11Au0.5Ag1.5]Sn-3 solders are near-eutectics with a narrow melting temperature range of 206.89-207.25 degrees C; while the Sn-Au-Ni solders are non-eutectics with a wide melting temperature range of 215.33-255.44 degrees C, due to a large difference in chemical property between Ni and Au. The microstructure of the Sn-Au-Ag solders consists of AuSn4 and Ag3Sn4 phases dispersed in beta-Sn matrix; while that of the Sn-Au-Ni solders consists of AuSn4 and Ni3Sn4 phases dispersed in beta-Sn matrix. The wettability of the Sn-Au-Ag(Ni) solders on Ni substrate is better than that on Cu substrate because of the severe interfacial reaction on Cu substrate. The shear strength of the [Sn11Au0.5Ag1.5]Sn-3 and [Sn11Au0.5Ni1.5]Sn-3 solder joints is 50.59 MPa and 36.28 MPa, respectively, which is significantly higher than that of eutectic Au-30 at% Sn solder joints (24.5 MPa). (C) 2016 Elsevier B.V. All rights reserved.